The trend of miniaturization and flattening of electronic equipment continues to grow, which is an inevitable trend in the consumer market. But now the demand for smaller power circuits has also spread to industrial and military applications, where space and weight saving are the requirements of the next generation design. The challenge faced by SAMYOUNG Electrolytic Capacitor in Korea is to purchase smaller components to save space without affecting the system life and reliability.
这在采购电容器时尤其困难，电容器通常是电源板上最高的组件之一。另一种方法是在并联时将电容器分布在大面积的 PC 板上，以满足保持和大容量存储的最小电容要求。然而，电容器制造技术和工艺正在改进，导致重新发明了不起眼的铝电解电容器，以实现更扁平的封装样式，以帮助电源设计人员满足他们的设计需求。
This is particularly difficult when purchasing capacitors, which are usually one of the highest components on the power board. Another method is to distribute the capacitors on a large area of PC board in parallel to meet the minimum capacitance requirements for holding and large capacity storage. However, the capacitor manufacturing technology and process are improving, leading to the reinvention of the inconspicuous aluminum electrolytic capacitor to achieve a more flat package style to help power designers meet their design needs.
电解电容器的发展在过去十年中，电容器的技术进步不断增加，有助于缩小组件尺寸。例如，材料规格的改进（例如用于铝电解的高增益阳极箔）有助于在给定电容器尺寸下实现更高的 CV（电容 * 电压）额定值。
The development of electrolytic capacitors In the past decade, the technological progress of capacitors has been increasing, helping to reduce the size of components. For example, improvements in material specifications, such as high gain anode foil for aluminum electrolysis, help to achieve higher CV (capacitance * voltage) ratings at a given capacitor size.
The development and application of new electrolyte systems, as well as improved lead connection technology, help to reduce ESR, thereby reducing power loss at the same amount of ripple current and allowing smaller components to be used without overheating. In general, these advances have been applied to existing packaging styles (overall dimensions) with limited potential space savings.
Since the invention of aluminum electrolytic capacitors, cylindrical packaging has been the main shape factor. Although this design concept promotes efficient manufacturing, it also poses challenges for component designers seeking to significantly reduce size and significantly extend service life. In addition, electrolytes have historically dried over time, limiting their service life.
在讨论其他封装类型在提高能量密度和预期寿命方面可以发挥的作用之前，先了解一下传统铝电解电容器的构造方式是很有用的。两层经过特殊蚀刻的镀铝箔由绝缘纸层（浸渍有液体电解质）隔开，缠绕在一起形成圆柱体，并封装在铝制外壳中。一个箔有一个氧化层，它成为阳极；第二个是阴极。阴极和阳极连接到引线或端子上，外壳用橡胶垫圈密封，以防止电解液逸出。外壳还有一个通风口，旨在释放氢气的内部压力。由此产生的封装必须足够坚固，能够承受各种操作条件，同时将其电解质保持在组件内。这种封装技术会占用大量空间。在最小的 SMT 封装尺寸中，封装材料（外壳、垫片、垫片等）可占到电容器成品总体积的 60%。
Before discussing the role that other packaging types can play in improving energy density and life expectancy, it is useful to understand the construction of traditional aluminum electrolytic capacitors. Two specially etched aluminum foils are separated by insulating paper layers (impregnated with liquid electrolyte), wound together to form a cylinder, and encapsulated in an aluminum housing. A foil has an oxide layer, which becomes an anode; The second is the cathode. The cathode and anode are connected to the lead or terminal, and the shell is sealed with rubber gasket to prevent electrolyte from escaping. The enclosure also has a vent designed to release the internal pressure of hydrogen. The resulting package must be strong enough to withstand various operating conditions while maintaining its electrolyte within the module. This packaging technology takes up a lot of space. In the smallest SMT package size, packaging materials (housing, gasket, gasket, etc.) can account for 60% of the total volume of the finished capacitor.
与 SMT 铝电解电容器相比，与之竞争的技术，尤其是钽电容器，已经实现了更高的能量密度和更低的每 CV 成本，尤其是在它们主导大容量存储和滤波的板级应用的较低电压下。在 PC 板上看到串联的钽电容器阵列并不少见，它们并联以满足所服务设备的保持要求。必须考虑在降低高度和电路板空间之间进行权衡，因为并联电容器之间的间距会进一步降低大容量存储和滤波所需的总电容解决方案的能量密度。
Compared with SMT aluminum electrolytic capacitors, competing technologies, especially tantalum capacitors, have achieved higher energy density and lower cost per CV, especially at lower voltages in board level applications where they dominate high-capacity storage and filtering. It is not uncommon to see tantalum capacitor arrays in series on the PC board. They are connected in parallel to meet the maintenance requirements of the equipment they serve. The tradeoff between reducing the height and board space must be considered, as the spacing between parallel capacitors further reduces the energy density of the total capacitance solution required for mass storage and filtering.
为了应对低高度、减少 PC 板占用空间、延长使用寿命和提高系统可靠性的挑战，Cornell Dubilier (CDE) 改进了其扁平电解电容器技术，以提供与更复杂的组合式替代方案相同或更好的价格和性能。
In order to meet the challenges of low height, reducing PC board space, extending service life and improving system reliability, Cornell Dubiliser (CDE) has improved its flat electrolytic capacitor technology to provide the same or better price and performance as more complex combined alternatives.
As future applications require thinner storage applications, we will continue to see a corresponding reduction in capacitor shape. Where space and weight requirements do not require complete optimization, cylindrical capacitors will continue to dominate. Even in flatpack design, there is room for continuous improvement.